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To miniaturise, increase reliability
and improve performance.
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| Given the competitive advantage offered by microelectronic integration know-how in the field of sensors, SENSOREX has its own design and production unit for thick film hybrid circuits using SMD transfer dies and bare chips. |
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A flexible and economic technology
This high-performance interconnection system consists of screen printed wires, dielectrics and resistors on a ceramic substrate. The components are transferred and connected by remelting, or by gluing and bare wiring. The function is isolated from the external environment, with a coating or by placing it in a housing in an inert atmosphere.
The functions produced can be upgraded and minor modifications can be made at a low cost.
Optimum performance
• Analogue and digital functions and power circuits.
• Single and double-side screen printing, metal holes and multiple films.
• Conductor definition : from 90 µm.
• Automatic Al and Au wiring between 17 µm and 300 µm.
• 0.1 Ohm to 100 MOhm resistors, TCR between 50 and 100 ppm/°C
• Temperature range : (-200°C); -55°C; +200°C.
• Very high resistance to vibrations.
• Mass production on formats up to 8’’ x 8’’.
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Applications
This miniaturisation technology makes it possible to produce compact products, improve reliability and optimise costs. It is particularly suited to on-board applications.
In all fields, it also offers the possibility of increasing system modularity by transferring modules incorporating primary functions onto a motherboard.
A wide range of additional skills
SENSOREX also offers mixed ASIC and hybrid solutions, Multi Chip Modules and intelligent units at very competitive prices.
On the strength of its reputation, SENSOREX puts its experience and know-how at the disposal of customers who wish to place their integration project or production in the hands of a partner they can trust.
Typical Environments
- Operating temperature : -55° to +200°C
- Vibration : 100g (100/1000Hz)
- Shock : 100g (6ms)
Norms used
- MIL STD 883E,
- MIL HDBK 217F,
- DO 160D,
- ABD 100,
- …
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To form high-performance, modular and compatible measurement chains.
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Technological choices
Whatever your application, SENSOREX can offer you a set of complementary electronic modules to interface with all the sensors in our range and also most other sensors on the
market.
From specific hybrid technology or ASIC circuit-based components to multi-channel digital interfaces with bus outputs, SENSOREX is an expert on analogue signal processing and combines it with digital intelligence to obtain increasingly high-performance and complex functions.
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Standardisation and modularity
- Format : SIL, DIL, DIN, EUROPE.
- Components or functions to be integrated and complete solutions for the following types of sensor : LVDT, RVDT, potentiometer, capacitive, strain gauge, inclinometer, accelerometer, gyroscope.
- Power supply : AC and DC multistandard.
- Output : analogue voltage/current, digital RS 232, 485, IEEE, FIP.
- Analogue and digital programmable interfaces.
- Products comply with EC standards.
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Applications
The different formats available have important functions in all fields of application:
- Integrators, single-purpose machines,
- Testing laboratories,
- On-board applications,
- Industrial processes, quality control, dimensional metrology,
- Severe environments.
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